Thomas Oppert, Vice President Global Sales & Marketing, berichtet von den Technik-Neuheiten…
Mehr Details Component assembly and soldering
Thorsten Teutsch, CEO of PacTech, talks about the future plans regarding the company´s wafer level packaging subcon activities. He also sees a growing demand for technology that is used for component assembly and component soldering.
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Daten und Kontakte
- www.pactech.de
- info@pactech.de
- +49 3321-4495130
- +49 3321-4495110
- Pac Tech - Packaging Technologies GmbH
Am Schlangenhorst 7-9
14641 Nauen
Deutschland
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